Extruded semi-rigid material with the unique "ping-pong" memory effect engineered for shoe toe-puffs and counters with PU adhesive and dual backer construction for superior bonding and structural performance.
Extruded Ni/PU composite with the signature "ping-pong" elastic memory — ensuring toe boxes and heel counters snap back to shape after compression, maintaining the shoe's form over its full lifecycle.
INTELON is a semi-rigid extruded material purpose-built for toe-puff and counter applications in footwear manufacturing. It features a PU adhesive system with two backers for reliable bonding to uppers under heat and pressure. Available in TMS1 and TMS2 grades across five thickness profiles from 0.50 mm up to 1.30 mm to suit lightweight athletic and heavy-duty safety footwear alike.
| INTELON Grade | Thickness* (mm) | Tolerance | Grade |
|---|---|---|---|
| 472 – TMS1 | 0.50 – 0.60 | ± 0.05 mm | TMS1 |
| 473 – TMS1 | 0.55 – 0.65 | ± 0.05 mm | TMS1 |
| 475 – TMS1 | 0.65 – 0.75 | ± 0.05 mm | TMS1 |
| 477 – TMS1 | 0.85 – 0.95 | ± 0.05 mm | TMS1 |
| 479 – TMS1 | 1.10 – 1.20 | ± 0.05 mm | TMS1 |
| INTELON Grade | Thickness* (mm) | Tolerance | Grade |
|---|---|---|---|
| 473 – TMS2 | 0.65 – 0.75 | ± 0.05 mm | TMS2 |
| 475 – TMS2 | 0.75 – 0.85 | ± 0.05 mm | TMS2 |
| 477 – TMS2 | 0.95 – 1.05 | ± 0.05 mm | TMS2 |
| 479 – TMS2 | 1.20 – 1.30 | ± 0.05 mm | TMS2 |

The toe puff is applied using a special pneumatic pressing machine equipped with a heated curved plate, timer, and thermostat. The curved plate conforms the INTELON to the last profile while the heat activates the PU adhesive.
Working conditions should be set to a press temperature between 130°C and 150°C. Contact time ranges from 6 to 12 seconds, increasing with the thickness of the article being processed. The effective interface temperature at the bond line must reach a minimum of 100°C to achieve full adhesive activation.
We recommend carrying out a preliminary bonding test before full production, as application conditions may vary depending on the characteristics of the upper material — particularly its thickness, surface texture, and thermal conductivity.
There is no binding time or constraint on the lasting period after application bonded components can proceed directly to the next production step.
Custom thickness profiles, TMS1 and TMS2 grades, slit rolls or die-cut blanks all available on request. Our team will help you select the right INTELON specification for your upper material and production process.